A Routing Direction and Remapping Based Algorithm For Flip-Chip Routing
نویسندگان
چکیده
The flip-chip package provides the best solution that has the highest chip density in all package technologies to support the pad-limited VLSI designs. In this paper, we propose a routing algorithm for the flip-chip package. The routing algorithm can search a suitable routing path from bump pads to driver pads and route each of them. In this routing algorithm, there are four stages including Classifying, Remapping, Global Routing and Detail Routing, respectively. Experimental results base on four benchmarks which are provided by CAD Contest Group and our total wire-length is shorter than the best results in the CAD Contest. The advantage is that the proposed algorithm uses less time to solve the problem of the flip-chip routing and the memory usage of the program is very low.
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